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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
Year : 2003Volume number : 26Issue:01
Control-Based Life-Cycle Forecasting(Article) Subject:
Demand Forecasting
Author:
Ricki G.
Ingalls
Bobbie L.
Foote
page:
05
-
13
Optimising The Operation Sequence Of A Chip Placement Machine Using Tsp Model(Article) Subject:
Fuji Fcp-Iv
,
Pick-And-Place Machine
Author:
Ratnesh
Kumar
page:
14
-
21
An Aproach For Grouping Circuit Cards Intofamilies To Minimize Assembly Time On A Placement Machine(Article) Subject:
Applied Operation S Research
Author:
Kimberley P.
Ellis
page:
22
-
30
A Fuzzy System For Pakage Shipment Selection For Electronic Systems(Article) Subject:
Fuzzy Expert System
Author:
Simona
Maor
page:
31
-
36
New Technique For The Design Of Advanced Ultrasonic Transducers For Wire Bonding(Article) Subject:
Fm Simulation
Author:
Lorenzo
Parrini
page:
37
-
45
Finite Element Contact Analysis On A Horn-Holder Assembley For Wire Bonding(Article) Subject:
Design Of Computations
Author:
Jang
Changsoo
page:
46
-
53
Modeling And Characterization Of The Polymer Stud Grid Array (Psga) Package : Electrical Thermal And Thermo -Mechanical Qualification(Article) Subject:
Polymer Stud
Author:
Arun
Chandrasekhar
page:
54
-
67
Evaluation And Optimization Of Package Processing And Design Through Solder Joint Profile Prediction(Article) Subject:
Flip-Chip
Author:
Betty H.
Yeung
page:
68
-
74
Processing Of Fluxing Underfills For Flip Chip-On-Laminate Assembly(Article) Subject:
Assembly
,
Flip Chi P
Author:
Zhao
Renzhe
page:
75
-
83
Phase Equilibria And Thermodynamic Properties Of Sn-Ag Based Pb-Free Solder Alloys(Article) Subject:
Calphad
Author:
Ikuo
Ohnuma
Xing Jun
Liu
page:
84
-
89