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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing

Year : 2003 Volume number : 26 Issue: 01

Control-Based Life-Cycle Forecasting (Article)
Subject: Demand Forecasting
Author: Ricki G. Ingalls      Bobbie L. Foote     
page:      05 - 13
Optimising The Operation Sequence Of A Chip Placement Machine Using Tsp Model (Article)
Subject: Fuji Fcp-Iv , Pick-And-Place Machine
Author: Ratnesh Kumar     
page:      14 - 21
An Aproach For Grouping Circuit Cards Intofamilies To Minimize Assembly Time On A Placement Machine (Article)
Subject: Applied Operation S Research
Author: Kimberley P. Ellis     
page:      22 - 30
A Fuzzy System For Pakage Shipment Selection For Electronic Systems (Article)
Subject: Fuzzy Expert System
Author: Simona Maor     
page:      31 - 36
New Technique For The Design Of Advanced Ultrasonic Transducers For Wire Bonding (Article)
Subject: Fm Simulation
Author: Lorenzo Parrini     
page:      37 - 45
Finite Element Contact Analysis On A Horn-Holder Assembley For Wire Bonding (Article)
Subject: Design Of Computations
Author: Jang Changsoo     
page:      46 - 53
Modeling And Characterization Of The Polymer Stud Grid Array (Psga) Package : Electrical Thermal And Thermo -Mechanical Qualification (Article)
Subject: Polymer Stud
Author: Arun Chandrasekhar     
page:      54 - 67
Evaluation And Optimization Of Package Processing And Design Through Solder Joint Profile Prediction (Article)
Subject: Flip-Chip
Author: Betty H. Yeung     
page:      68 - 74
Processing Of Fluxing Underfills For Flip Chip-On-Laminate Assembly (Article)
Subject: Assembly , Flip Chi P
Author: Zhao Renzhe     
page:      75 - 83
Phase Equilibria And Thermodynamic Properties Of Sn-Ag Based Pb-Free Solder Alloys (Article)
Subject: Calphad
Author: Ikuo Ohnuma      Xing Jun Liu     
page:      84 - 89